Intel - EP2AGX65DF29C6G

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EP2AGX65DF29C6G by Intel

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Manufacturer Intel
Manufacturer's Part Number EP2AGX65DF29C6G
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: HBGA; Package Shape: SQUARE;
Datasheet EP2AGX65DF29C6G Datasheet
In Stock437
NAME DESCRIPTION
Minimum Supply Voltage: .87 V
Package Body Material: Plastic/Epoxy
Organization: 2530 CLBS
Maximum Seated Height: 2.6 mm
No. of Inputs: 372
Surface Mount: Yes
No. of Outputs: 372
Position Of Terminal: Bottom
No. of Terminals: 780
Package Style (Meter): Grid Array, Heat Sink/Slug
JESD-30 Code: S-PBGA-B780
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: HBGA
Width: 29 mm
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: .93 V
Nominal Supply Voltage (V): 0.9
No. of Logic Cells: 60214
No. of CLBs: 2530
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA780,28X28,40
Length: 29 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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