Intel - EP3C120F780I7N

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EP3C120F780I7N by Intel

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Manufacturer Intel
Manufacturer's Part Number EP3C120F780I7N
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: RECTANGULAR;
Datasheet EP3C120F780I7N Datasheet
In Stock216
NAME DESCRIPTION
Minimum Supply Voltage: 1.15 V
Package Body Material: Plastic/Epoxy
Organization: 119088 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 3.5 mm
No. of Inputs: 531
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 531
Position Of Terminal: Bottom
No. of Terminals: 780
Package Style (Meter): Grid Array
JESD-30 Code: R-PBGA-B780
Maximum Clock Frequency: 472.5 MHz
Package Shape: Rectangular
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 29 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.25 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 119088
No. of CLBs: 119088
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA780,28X28,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 29 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
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