Intel - EP3C25F324I7N

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EP3C25F324I7N by Intel

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Manufacturer Intel
Manufacturer's Part Number EP3C25F324I7N
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: RECTANGULAR;
Datasheet EP3C25F324I7N Datasheet
In Stock279
NAME DESCRIPTION
Minimum Supply Voltage: 1.15 V
Package Body Material: Plastic/Epoxy
Organization: 24624 CLBS
Maximum Seated Height: 2.2 mm
No. of Inputs: 215
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 215
Position Of Terminal: Bottom
No. of Terminals: 324
Package Style (Meter): Grid Array
JESD-30 Code: R-PBGA-B324
Maximum Clock Frequency: 472.5 MHz
Package Shape: Rectangular
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.25 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 24624
No. of CLBs: 24624
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA324,18X18,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 19 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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