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Manufacturer | Intel |
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Manufacturer's Part Number | EP3C55U484C7N |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: RECTANGULAR; |
Datasheet | EP3C55U484C7N Datasheet |
In Stock | 246 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.15 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 55856 CLBS |
Maximum Seated Height: | 2.2 mm |
No. of Inputs: | 327 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 327 |
Position Of Terminal: | Bottom |
No. of Terminals: | 484 |
Package Style (Meter): | Grid Array, Fine Pitch |
JESD-30 Code: | R-PBGA-B484 |
Maximum Clock Frequency: | 472.5 MHz |
Package Shape: | Rectangular |
Maximum Operating Temperature: | 85 °C (185 °F) |
Package Code: | FBGA |
Width: | 19 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Other |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.25 V |
Nominal Supply Voltage (V): | 1.2 |
Technology Used: | CMOS |
No. of Logic Cells: | 55856 |
No. of CLBs: | 55856 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 °C (32 °F) |
Qualification: | No |
Package Equivalence Code: | BGA484,22X22,32 |
Finishing Of Terminal Used: | Tin Silver Copper |
Length: | 19 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | .8 mm |