Intel - EP4CGX22CF19I7N

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EP4CGX22CF19I7N by Intel

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Manufacturer Intel
Manufacturer's Part Number EP4CGX22CF19I7N
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LBGA; Package Shape: SQUARE; Maximum Seated Height: 1.55 mm;
Datasheet EP4CGX22CF19I7N Datasheet
In Stock32
NAME DESCRIPTION
Minimum Supply Voltage: 1.16 V
Package Body Material: Plastic/Epoxy
Organization: 1330 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.55 mm
No. of Inputs: 150
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 150
Position Of Terminal: Bottom
No. of Terminals: 324
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 472.5 MHz
Package Shape: Square
Package Code: LBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.24 V
Nominal Supply Voltage (V): 1.2
No. of Logic Cells: 21280
No. of CLBs: 1330
JESD-609 Code: e1
Qualification: No
Package Equivalence Code: BGA324,18X18,40
Finishing Of Terminal Used: Tin/Silver/Copper
Length: 19 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2,1.2/3.3,2.5 V
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