Intel - EPM2210F324C5N

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EPM2210F324C5N by Intel

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Manufacturer Intel
Manufacturer's Part Number EPM2210F324C5N
Description FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
Datasheet EPM2210F324C5N Datasheet
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NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 11.2 ns
Organization: 0 Dedicated Inputs, 272 I/O
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 2.2 mm
No. of Inputs: 272
Sub-Category: Programmable Logic Devices
Surface Mount: Yes
No. of Outputs: 272
Position Of Terminal: Bottom
No. of Terminals: 324
JTAG Boundary Scan Test: Yes
No. of I/O Lines: 272
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B324
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 19 mm
No. of Dedicated Inputs: 0
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: Flash PLD
Maximum Supply Voltage: 2.625 V
Nominal Supply Voltage (V): 2.5
Technology Used: CMOS
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA324,18X18,40
Finishing Of Terminal Used: Tin/Silver/Copper
Length: 19 mm
Form Of Terminal: Ball
In-System Programmable: Yes
Additional Features: It can also operate at 3.3 V
Output Function: Macrocell
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
No. of Macro Cells: 1700
Power Supplies (V): 1.5/3.3,2.5/3.3 V
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