Intel - EPM570F256I5N

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EPM570F256I5N by Intel

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Manufacturer Intel
Manufacturer's Part Number EPM570F256I5N
Description FLASH PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Datasheet EPM570F256I5N Datasheet
In Stock144
NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 8.7 ns
Organization: 0 Dedicated Inputs, 160 I/O
Maximum Seated Height: 2.2 mm
No. of Inputs: 160
Sub-Category: Programmable Logic Devices
Surface Mount: Yes
No. of Outputs: 160
Position Of Terminal: Bottom
No. of Terminals: 256
JTAG Boundary Scan Test: Yes
No. of I/O Lines: 160
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 17 mm
No. of Dedicated Inputs: 0
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: Flash PLD
Maximum Supply Voltage: 2.625 V
Nominal Supply Voltage (V): 2.5
Technology Used: CMOS
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
In-System Programmable: Yes
Additional Features: It can also operate at 3.3 V
Output Function: Macrocell
Pitch Of Terminal: 1 mm
No. of Macro Cells: 440
Power Supplies (V): 1.5/3.3,2.5/3.3 V
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