Keystone Electronics - 4593

IC SOCKET; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;

IC SOCKET; Device Type Used On: DIP40; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 40;

TE Connectivity's 828-AG11D-ESL is a DIP28 IC SOCKET with 28 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 15.24mm row spacing and polyester housing material. Ideal for applications requiring a solder termination type, it operates b/w -55°C to 125°C temperature range.

173-10-324-00-001000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for DIP24 devices. Featuring 24 contacts with GOLD OVER NICKEL finish, it is a RECTANGLE contact configuration ideal for integrated circuit applications.

IC SOCKET; Housing Material: NYLON; No. of Contacts: 14; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SCREW;

IC SOCKET; Device Type Used On: DIP24; JESD-609 Code: e4; No. of Contacts: 24; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): NOT SPECIFIED;

RELAY SOCKET;

Mill-max Mfg's 551-10-155-18-121003 is a PGA155 IC socket with 155 contacts. It features gold (Au) mating finish over nickel (Ni), and gold (Au) termination finish with Ni barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier applications.

IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;

IC SOCKET; Housing Material: NYLON; Termination Type: SOLDER; No. of Contacts: 11; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;

TE Connectivity's 8134-HC-5P3 is a Chip Carrier IC Socket with -65 to 125°C temp range, PRESS FIT termination, and 5A current rating. Ideal for straight mounting applications in electronic devices requiring reliable IC connections.

The Samtec GFZ-30-03-G-10-AD is an IC socket with 300 contacts, made of beryllium copper with gold over nickel finish. It is designed for LGA300 devices and features a housing material of liquid crystal polymer. Ideal for chip carrier applications due to its high-quality contact materials and construction.

Finder 90.23 is a chip carrier IC & component socket used on relays. It has 11 contacts, a rating of 10A, and can withstand up to 2000VAC. With a temperature range of -40°C to 70°C, it is suitable for various applications requiring reliable relay connections.

IC SOCKET; Device Type Used On: DIP24; Housing Material: PCT POLYESTER; Contact Material: NOT SPECIFIED; No. of Contacts: 24; Contact Finish (Mating): NOT SPECIFIED;

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;

110-83-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated for 1A current. It features Beryllium Copper contact material, Gold mating finish, and Tin termination finish. With a PCB contact row spacing of 7.62mm, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for chip carrier IC applications due to its high insulation resistance and durable housing material.

IC SOCKET; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;

RELAY SOCKET; Manufacturer Series: SZX-SLF-08N; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;

350-10-108-00-001000 by Mill-max Mfg is a POLYETHYLENE Chip Carrier IC Socket for SIP8 devices with 8 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for electronic applications requiring reliable connection and durability.