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Manufacturer | Lattice Semiconductor |
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Manufacturer's Part Number | ICE40UP3K-UWG30ITR |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 30; Package Code: VFBGA; Package Shape: RECTANGULAR; |
Datasheet | ICE40UP3K-UWG30ITR Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.14 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 350 CLBS |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Combinatorial Delay of a CLB: | 9 ns |
Maximum Seated Height: | .6 mm |
No. of Inputs: | 21 |
Surface Mount: | Yes |
No. of Outputs: | 21 |
Position Of Terminal: | Bottom |
No. of Terminals: | 30 |
Package Style (Meter): | Grid Array, Very Thin Profile, Fine Pitch |
JESD-30 Code: | R-PBGA-B30 |
Package Shape: | Rectangular |
Maximum Operating Temperature: | 100 °C (212 °F) |
Package Code: | VFBGA |
Width: | 2.114 mm |
Moisture Sensitivity Level (MSL): | 1 |
Grading Of Temperature: | Industrial |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.26 V |
Nominal Supply Voltage (V): | 1.2 |
Packing Method: | Tape and Reel |
Technology Used: | CMOS |
No. of Logic Cells: | 2800 |
No. of CLBs: | 350 |
Minimum Operating Temperature: | -40 °C (-40 °F) |
Package Equivalence Code: | BGA30,5X6,16 |
Length: | 2.537 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | .4 mm |
Peak Reflow Temperature (C): | 260 °C (500 °F) |