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Manufacturer | Lattice Semiconductor |
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Manufacturer's Part Number | LCMXO2-7000ZE-1BG332I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 332; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA332,20X20,32; |
Datasheet | LCMXO2-7000ZE-1BG332I Datasheet |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.14 V |
Package Body Material: | Plastic/Epoxy |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 2 mm |
No. of Inputs: | 278 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 278 |
Position Of Terminal: | Bottom |
No. of Terminals: | 332 |
Package Style (Meter): | Grid Array, Fine Pitch |
JESD-30 Code: | S-PBGA-B332 |
Package Shape: | Square |
Maximum Operating Temperature: | 100 °C (212 °F) |
Package Code: | FBGA |
Width: | 17 mm |
Moisture Sensitivity Level (MSL): | 3 |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.26 V |
Nominal Supply Voltage (V): | 1.2 |
Packing Method: | Tray |
No. of Logic Cells: | 6864 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 °C (-40 °F) |
Qualification: | No |
Package Equivalence Code: | BGA332,20X20,32 |
Finishing Of Terminal Used: | Tin/Silver/Copper |
Length: | 17 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | .8 mm |
Peak Reflow Temperature (C): | 260 °C (500 °F) |
Power Supplies (V): | 1.2 V |