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Manufacturer | Macronix |
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Manufacturer's Part Number | MX30LF2G18AC-XKI |
Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
Datasheet | MX30LF2G18AC-XKI Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 256MX8 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1 mm |
Programming Voltage (V): | 3 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
No. of Terminals: | 63 |
No. of Words: | 268435456 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B63 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Width: | 9 mm |
Memory Density: | 2147483648 bit |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Type: | SLC NAND TYPE |
Length: | 11 mm |
No. of Words Code: | 256M |
Nominal Supply Voltage / Vsup (V): | 3 |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |