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| Manufacturer | Macronix |
|---|---|
| Manufacturer's Part Number | MX30LF2G18AC-XKI |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | MX30LF2G18AC-XKI Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 256MX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 1 mm |
| Programming Voltage (V): | 3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| No. of Terminals: | 63 |
| No. of Words: | 268435456 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B63 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | 9 mm |
| Other Names: |
6309G-63XKAIY2BF99 1092-1165 |
| Memory Density: | 2147483648 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | SLC NAND TYPE |
| Length: | 11 mm |
| No. of Words Code: | 256M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
