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| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | DS1213C |
| Description | MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | DS1213C Datasheet |
| In Stock | 632 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Seated Height: | 11.94 mm |
| Surface Mount: | NO |
| Memory IC Type: | MEMORY CIRCUIT |
| Terminal Finish: | TIN LEAD |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 28 |
| Qualification: | Not Qualified |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Length: | 35.56 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-PDIP-T28 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIP |
| Width: | 15.24 mm |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | COMMERCIAL |
| Moisture Sensitivity Level (MSL): | 1 |
