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Manufacturer | Maxim Integrated |
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Manufacturer's Part Number | DS21FF42N |
Description | FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 300; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | DS21FF42N Datasheet |
In Stock | 184 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Seated Height: | 2.54 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 300 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B300 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Width: | 27 mm |
Moisture Sensitivity Level (MSL): | 4 |
Telecom IC Type: | FRAMER |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA300,20X20,50 |
Length: | 27 mm |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |