Image shown is a representation only.
| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | DS2401X1#U |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Code: FBGA; Package Shape: RECTANGULAR; Power Supplies (V): 3/5; |
| Datasheet | DS2401X1#U Datasheet |
| In Stock | 2,089 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 2 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA2,1X2,28 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| JESD-30 Code: | R-PBGA-B2 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | FBGA |
| Terminal Pitch: | .7 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/5 |
