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| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | DS2502-E64 |
| Description | OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Shape: ROUND; Package Body Material: PLASTIC/EPOXY; Peak Reflow Temperature (C): 245; |
| Datasheet | DS2502-E64 Datasheet |
| In Stock | 552 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Memory Density: | 1024 bit |
| Organization: | 1KX1 |
| Minimum Supply Voltage (Vsup): | 2.8 V |
| Surface Mount: | NO |
| Memory IC Type: | OTP ROM |
| Terminal Finish: | TIN LEAD |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| No. of Terminals: | 3 |
| No. of Words: | 1024 words |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Technology: | CMOS |
| No. of Words Code: | 1K |
| JESD-30 Code: | O-PBCY-T3 |
| Package Shape: | ROUND |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 245 |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 6 V |
