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| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | DS31404GN+ |
| Description | Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | DS31404GN+ Datasheet |
| In Stock | 1,484 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.8 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 256 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA256,16X16,40 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| JESD-30 Code: | S-PBGA-B256 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | BGA |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.8 |
| Moisture Sensitivity Level (MSL): | 3 |
