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Manufacturer | Maxim Integrated |
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Manufacturer's Part Number | DS33ZH11+ |
Description | SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | DS33ZH11+ Datasheet |
In Stock | 244 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.8 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Telecom IC Type: | SUPPORT CIRCUIT |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
No. of Terminals: | 100 |
Qualification: | Not Qualified |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Length: | 10 mm |
JESD-30 Code: | S-PBGA-B100 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | FBGA |
Width: | 10 mm |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |