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Manufacturer | Maxim Integrated |
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Manufacturer's Part Number | MAX13013EBT+T |
Description | Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: FBGA; Package Shape: RECTANGULAR; |
Datasheet | MAX13013EBT+T Datasheet |
In Stock | 913 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Other Interface ICs |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 6 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA6,2X3,20 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | BICMOS |
JESD-30 Code: | R-PBGA-B6 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | FBGA |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.8/3.3 |
Moisture Sensitivity Level (MSL): | 1 |