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| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | MAX2314EEI+ |
| Description | BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: HSSOP; Package Shape: RECTANGULAR; |
| Datasheet | MAX2314EEI+ Datasheet |
| In Stock | 2,099 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 2.75 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.73 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | .0415 mA |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 28 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
| JESD-30 Code: | R-PDSO-G28 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HSSOP |
| Width: | 3.9 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | BASEBAND CIRCUIT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SSOP28,.25 |
| Length: | 9.89 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .635 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/5 |
