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Manufacturer | Maxim Integrated |
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Manufacturer's Part Number | MAX2839ASEWO+T |
Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 73; Package Code: VFBGA; Package Shape: RECTANGULAR; |
Datasheet | MAX2839ASEWO+T Datasheet |
In Stock | 1,039 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2.8 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .7 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Maximum Supply Current: | .2 mA |
No. of Terminals: | 73 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | BICMOS |
JESD-30 Code: | R-PBGA-B73 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Width: | 3.61 mm |
Moisture Sensitivity Level (MSL): | 1 |
Telecom IC Type: | TELECOM CIRCUIT |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA73(UNSPEC) |
Length: | 5.11 mm |
Peak Reflow Temperature (C): | 260 |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3/3.3 |