Image shown is a representation only.
| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | MAX2839ASEWO+T |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 73; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | MAX2839ASEWO+T Datasheet |
| In Stock | 1,039 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 2.8 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .7 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | .2 mA |
| No. of Terminals: | 73 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | BICMOS |
| JESD-30 Code: | R-PBGA-B73 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | 3.61 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA73(UNSPEC) |
| Length: | 5.11 mm |
| Peak Reflow Temperature (C): | 260 |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/3.3 |
