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| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | MAX3013EBP+T |
| Description | Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 20; Package Code: FBGA; Package Shape: RECTANGULAR; |
| Datasheet | MAX3013EBP+T Datasheet |
| In Stock | 1,150 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Sub-Category: | Other Interface ICs |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 20 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA20,4X5,20 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | BICMOS |
| JESD-30 Code: | R-PBGA-B20 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.8/3.3 |
