
Image shown is a representation only.
Manufacturer | Maxim Integrated |
---|---|
Manufacturer's Part Number | MAX3390EEBC |
Description | INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 12; Package Code: FBGA; Package Shape: RECTANGULAR; |
Datasheet | MAX3390EEBC Datasheet |
In Stock | 2,500 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Other Interface ICs |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 12 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA12,3X4,20 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | BICMOS |
JESD-30 Code: | R-PBGA-B12 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Interface IC Type: | INTERFACE CIRCUIT |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.8/5 |
Moisture Sensitivity Level (MSL): | 1 |