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| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | MAX3768CUB+T |
| Description | TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE; |
| Datasheet | MAX3768CUB+T Datasheet |
| In Stock | 99 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.1 mm |
| Sub-Category: | ATM/SONET/SDH ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | .062 mA |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 10 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Technology: | BIPOLAR |
| JESD-30 Code: | S-PDSO-G10 |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | HTSSOP |
| Width: | 3 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP10,.19,20 |
| Length: | 3 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 3.3/5 |
