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Manufacturer | Maxim Integrated |
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Manufacturer's Part Number | MAX7359EWA+ |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: VFBGA; Package Shape: SQUARE; |
Datasheet | MAX7359EWA+ Datasheet |
In Stock | 406 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.62 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2.5 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .69 mm |
Sub-Category: | Parallel IO Port |
Surface Mount: | YES |
Maximum Supply Current: | .06 mA |
Terminal Finish: | TIN SILVER COPPER NICKEL |
No. of Terminals: | 25 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | BICMOS |
JESD-30 Code: | S-PBGA-B25 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Width: | 2.09 mm |
Moisture Sensitivity Level (MSL): | 1 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | 3.6 V |
JESD-609 Code: | e2 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA25,5X5,16 |
Length: | 2.09 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .4 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.8/3.3 |