Maxim Integrated - MAX961EUA-T

COMPARATOR; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

COMPARATOR; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

COMPARATOR; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

COMPARATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

LT6700CS6-3#TRMPBF by Analog Devices is a comparator with 2 functions, open-collector output type, and response time of 29000 ns. It operates b/w 0 to 70 °C and has a supply voltage of 5V. Ideal for applications requiring precise voltage comparisons in commercial-grade environments.

AD8561ARZ-REEL by Analog Devices is a comparator with 8000uV max input offset voltage, 7ns response time, and -40 to 85°C operating temp range. Ideal for industrial applications requiring fast response times in compact designs.

COMPARATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: VSSOP; Package Shape: RECTANGULAR;

LM311DRG4 by Texas Instruments is a comparator with 10000 uV max input offset voltage and 0.3 uA max average bias current. It operates at +-15 V power supplies, has open-collector output type, and response time of 115 ns. Widely used in commercial applications due to its small outline package style and dual terminal position for precise voltage comparisons.

Comparators;

LM211N by Texas Instruments is a bipolar technology comparator with 14 terminals and a max input offset voltage of 4000 uV. It operates in industrial temperature grades from -40 to 85 °C, suitable for applications requiring precise voltage comparisons in various electronic circuits. The package style is rectangular with through-hole terminal form, making it ideal for industrial automation and control systems.

COMPARATOR; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

COMPARATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: VSSOP; Package Shape: RECTANGULAR;

COMPARATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR;

LMV331IDCKRG4 by Texas Instruments is a comparator with 9000uV max input offset voltage, 0.4uA max average bias current, and 600ns nominal response time. Ideal for automotive applications due to its small outline package style and -40 to 125 °C operating temperature range.

COMPARATOR; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

LM2903NG by Onsemi is a dual comparator with 15000uV max input offset voltage and 0.5uA max average bias current. Widely used in industrial applications, it operates b/w -40 to 105 °C, with open-collector output type and 2.5mA max supply current.

LM211DR2 by Onsemi is a comparator with a max input offset voltage of 4000 uV and max average bias current of 0.15 uA. It operates at temperatures ranging from -25 to 85 °C and has an open-collector output type. This small outline package is ideal for applications requiring precise voltage comparisons in electronic circuits.

COMPARATOR; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

LM339AMX by Texas Instruments is a comparator with 4 functions, operating at -25 to 85 °C. It has a max input offset voltage of 4000 uV and a max average bias current of 0.4 uA. Widely used in applications requiring open-collector output type and fast response time of 1300 ns.

LM2901YPT by STMicroelectronics is a comparator with a max input offset voltage of 15000 uV, max average bias current of 0.4 uA, and a nominal voltage of 5V. It is commonly used in automotive applications due to its AEC-Q100 screening level and compact package design.