
Image shown is a representation only.
Manufacturer | Microchip Technology |
---|---|
Manufacturer's Part Number | 24AA64-I/MSG |
Description | EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE; JESD-609 Code: e3; |
Datasheet | 24AA64-I/MSG Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .000001 Amp |
Organization: | 8KX8 |
Maximum Seated Height: | 1.1 mm |
Minimum Supply Voltage (Vsup): | 1.7 V |
Sub-Category: | EEPROMs |
Surface Mount: | YES |
Maximum Supply Current: | 3 mA |
Terminal Finish: | Matte Tin (Sn) |
Maximum Write Cycle Time (tWC): | 5 ms |
No. of Terminals: | 8 |
I2C Control Byte: | 1010DDDR |
Maximum Clock Frequency (fCLK): | .4 MHz |
No. of Words: | 8192 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Write Protection: | HARDWARE |
Technology: | CMOS |
JESD-30 Code: | S-PDSO-G8 |
Package Shape: | SQUARE |
Terminal Form: | GULL WING |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Endurance: | 1000000 Write/Erase Cycles |
Package Code: | TSSOP |
Width: | 3 mm |
Moisture Sensitivity Level (MSL): | 1 |
Serial Bus Type: | I2C |
Memory Density: | 65536 bit |
Memory IC Type: | EEPROM |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | TSSOP8,.19 |
Length: | 3 mm |
No. of Words Code: | 8K |
Nominal Supply Voltage / Vsup (V): | 2.5 |
Minimum Data Retention Time: | 200 |
Parallel or Serial: | SERIAL |
Terminal Pitch: | .65 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 5.5 V |
Power Supplies (V): | 2/5 |