
Image shown is a representation only.
Manufacturer | Microchip Technology |
---|---|
Manufacturer's Part Number | 25AA02UIDT-I/OT |
Description | EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 1; |
Datasheet | 25AA02UIDT-I/OT Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Organization: | 256X8 |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.45 mm |
Programming Voltage (V): | 5 |
Minimum Supply Voltage (Vsup): | 4.5 V |
Surface Mount: | YES |
Terminal Finish: | MATTE TIN |
Maximum Write Cycle Time (tWC): | 5 ms |
No. of Terminals: | 6 |
Maximum Clock Frequency (fCLK): | 10 MHz |
No. of Words: | 256 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
Screening Level: | TS 16949 |
Write Protection: | HARDWARE |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G6 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Endurance: | 1000000 Write/Erase Cycles |
Package Code: | LSSOP |
Width: | 1.55 mm |
Moisture Sensitivity Level (MSL): | 1 |
Serial Bus Type: | SPI |
No. of Ports: | 1 |
Memory Density: | 2048 bit |
Memory IC Type: | EEPROM |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Package Equivalence Code: | TSOP6,.11,37 |
Length: | 2.9 mm |
No. of Words Code: | 256 |
Nominal Supply Voltage / Vsup (V): | 5 |
Additional Features: | 2.5V TO 4.5V @ 5MHz AND 1.8V TO 2.5V @ 3MHz |
Minimum Data Retention Time: | 200 |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | SERIAL |
Terminal Pitch: | .95 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 5.5 V |