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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | 47L16T-I/ST |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP8,.25; |
| Datasheet | 47L16T-I/ST Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 2KX8 |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 8 |
| No. of Words: | 2048 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TSSOP |
| Width: | 3 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| No. of Ports: | 1 |
| Memory Density: | 16384 bit |
| Mixed Memory Type: | EEPROM+SRAM |
| Memory IC Type: | MEMORY CIRCUIT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Package Equivalence Code: | TSSOP8,.25 |
| Length: | 4.4 mm |
| Maximum Access Time: | 400 ns |
| No. of Words Code: | 2K |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
