
Image shown is a representation only.
Manufacturer | Microchip Technology |
---|---|
Manufacturer's Part Number | 93LC56BT-I/MC |
Description | EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Standby Current: .000001 Amp; |
Datasheet | 93LC56BT-I/MC Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Minimum Supply Voltage (Vsup): | 2.5 V |
Surface Mount: | YES |
Screening Level: | TS 16949 |
Technology: | CMOS |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Operating Mode: | SYNCHRONOUS |
Package Code: | HVSON |
Moisture Sensitivity Level (MSL): | 1 |
No. of Ports: | 1 |
Toggle Bit: | YES |
Memory Width: | 16 |
Qualification: | Not Qualified |
Package Equivalence Code: | SOLCC8,.11,20 |
Minimum Data Retention Time: | 200 |
Ready or Busy: | YES |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Reverse Pinout: | NO |
Maximum Standby Current: | .000001 Amp |
Organization: | 128X16 |
Output Characteristics: | TOTEM POLE |
Maximum Seated Height: | 1 mm |
Maximum Supply Current: | 2 mA |
Terminal Finish: | MATTE TIN |
Maximum Write Cycle Time (tWC): | 6 ms |
No. of Terminals: | 8 |
Maximum Clock Frequency (fCLK): | 2 MHz |
No. of Words: | 128 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Write Protection: | SOFTWARE |
JESD-30 Code: | R-PDSO-N8 |
Maximum Operating Temperature: | 85 Cel |
Endurance: | 1000000 Write/Erase Cycles |
Width: | 2 mm |
Serial Bus Type: | MICROWIRE |
Memory Density: | 2048 bit |
Memory IC Type: | EEPROM |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Length: | 3 mm |
No. of Words Code: | 128 |
Nominal Supply Voltage / Vsup (V): | 3 |
Parallel or Serial: | SERIAL |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 5.5 V |