Microchip Technology - A2F200M3F-FGG256I

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A2F200M3F-FGG256I by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number A2F200M3F-FGG256I
Description SoC FPGA; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;
Datasheet A2F200M3F-FGG256I Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC FPGA
Nominal Supply Voltage: 1.5 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Supply Voltage: 1.575 V
Surface Mount: YES
Terminal Finish: MATTE TIN
Minimum Operating Temperature: -40 Cel
No. of Terminals: 256
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE
Technology: CMOS
JESD-30 Code: S-PBGA-B256
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Peak Reflow Temperature (C): 250
Package Code: LBGA
Moisture Sensitivity Level (MSL): 3
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