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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | A2F200M3F-FGG256I |
| Description | SoC FPGA; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES; |
| Datasheet | A2F200M3F-FGG256I Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.425 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SoC FPGA |
| Nominal Supply Voltage: | 1.5 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Supply Voltage: | 1.575 V |
| Surface Mount: | YES |
| Terminal Finish: | MATTE TIN |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 256 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B256 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 100 Cel |
| Peak Reflow Temperature (C): | 250 |
| Package Code: | LBGA |
| Moisture Sensitivity Level (MSL): | 3 |
