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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | A3P1000-FG144I |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE; |
| Datasheet | A3P1000-FG144I Datasheet |
| In Stock | 177 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.425 V |
| Package Body Material: | Plastic/Epoxy |
| Organization: | 24576 CLBS, 1000000 Gates |
| Maximum Time At Peak Reflow Temperature (s): | 20 s |
| Maximum Seated Height: | 1.55 mm |
| Surface Mount: | Yes |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 144 |
| No. of Equivalent Gates: | 1000000 |
| Package Style (Meter): | Grid Array, Low Profile |
| JESD-30 Code: | S-PBGA-B144 |
| Maximum Clock Frequency: | 350 MHz |
| Package Shape: | Square |
| Maximum Operating Temperature: | 100 °C (212 °F) |
| Package Code: | LBGA |
| Width: | 13 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Grading Of Temperature: | Industrial |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 1.575 V |
| Nominal Supply Voltage (V): | 1.5 |
| Packing Method: | Tray |
| Technology Used: | CMOS |
| No. of CLBs: | 24576 |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 °C (-40 °F) |
| Qualification: | No |
| Finishing Of Terminal Used: | Tin Lead |
| Length: | 13 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | 1 mm |
| Peak Reflow Temperature (C): | 235 °C (455 °F) |








