Microchip Technology - A3P1000L-1FGG144I

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A3P1000L-1FGG144I by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number A3P1000L-1FGG144I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
Datasheet A3P1000L-1FGG144I Datasheet
In Stock23
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 24576 CLBS, 1000000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.55 mm
No. of Inputs: 97
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 97
Position Of Terminal: Bottom
No. of Terminals: 144
No. of Equivalent Gates: 1000000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B144
Maximum Clock Frequency: 350 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.2
Packing Method: Tray
Technology Used: CMOS
No. of Logic Cells: 24576
No. of CLBs: 24576
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA144,12X12,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 13 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.5/3.3 V
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