Microchip Technology - A3P600-FGG256IY

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A3P600-FGG256IY by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number A3P600-FGG256IY
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; No. of Equivalent Gates: 600000;
Datasheet A3P600-FGG256IY Datasheet
In Stock1,298
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 13824 CLBS, 600000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.7 mm
No. of Inputs: 177
Surface Mount: Yes
No. of Outputs: 177
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 600000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B256
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of CLBs: 13824
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA256,16X16,40
Length: 1.7 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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