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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | A54SX32A-FG256I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | A54SX32A-FG256I Datasheet |
In Stock | 102 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 2.25 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 2880 CLBS, 48000 Gates |
Maximum Time At Peak Reflow Temperature (s): | 20 s |
Maximum Combinatorial Delay of a CLB: | 1.2 ns |
Maximum Seated Height: | 1.97 mm |
No. of Inputs: | 203 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 203 |
Position Of Terminal: | Bottom |
No. of Terminals: | 256 |
No. of Equivalent Gates: | 48000 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B256 |
Maximum Clock Frequency: | 238 MHz |
Package Shape: | Square |
Maximum Operating Temperature: | 85 °C (185 °F) |
Package Code: | BGA |
Width: | 17 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Industrial |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 2.75 V |
Nominal Supply Voltage (V): | 2.5 |
Technology Used: | CMOS |
No. of Logic Cells: | 2880 |
No. of CLBs: | 2880 |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 °C (-40 °F) |
Qualification: | No |
Package Equivalence Code: | BGA256,16X16,40 |
Finishing Of Terminal Used: | Tin Lead |
Length: | 17 mm |
Form Of Terminal: | Ball |
Additional Features: | 32000 typical gates available |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Power Supplies (V): | 2.5,3.3/5 V |