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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | AFS600-FGG256K |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; |
Datasheet | AFS600-FGG256K Datasheet |
In Stock | 6 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.425 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 600000 Gates |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 1.7 mm |
Surface Mount: | Yes |
Position Of Terminal: | Bottom |
No. of Terminals: | 256 |
No. of Equivalent Gates: | 600000 |
Package Style (Meter): | Grid Array, Low Profile |
JESD-30 Code: | S-PBGA-B256 |
Package Shape: | Square |
Maximum Operating Temperature: | 100 °C (212 °F) |
Package Code: | LBGA |
Width: | 17 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Other |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.575 V |
Nominal Supply Voltage (V): | 1.5 |
Packing Method: | Tray |
Technology Used: | CMOS |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -55 °C (-67 °F) |
Qualification: | No |
Finishing Of Terminal Used: | Tin Silver Copper |
Length: | 17 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 250 °C (482 °F) |