Image shown is a representation only.
| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | AGLN250V5-CSG81I |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 81; Package Code: VFBGA; Package Shape: SQUARE; |
| Datasheet | AGLN250V5-CSG81I Datasheet |
| In Stock | 523 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.425 V |
| Package Body Material: | Plastic/Epoxy |
| Organization: | 6144 CLBS, 250000 Gates |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| Maximum Seated Height: | .8 mm |
| Surface Mount: | Yes |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 81 |
| No. of Equivalent Gates: | 250000 |
| Package Style (Meter): | Grid Array, Very Thin Profile, Fine Pitch |
| JESD-30 Code: | S-PBGA-B81 |
| Package Shape: | Square |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | VFBGA |
| Width: | 5 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Grading Of Temperature: | Industrial |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 1.575 V |
| Nominal Supply Voltage (V): | 1.5 |
| Packing Method: | Tray |
| Technology Used: | CMOS |
| No. of CLBs: | 6144 |
| Minimum Operating Temperature: | -40 °C (-40 °F) |
| Qualification: | No |
| Length: | 5 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | .5 mm |
| Peak Reflow Temperature (C): | 260 °C (500 °F) |









