Microchip Technology - APA300-FG144M

APA300-FG144M by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number APA300-FG144M
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
Datasheet APA300-FG144M Datasheet
In Stock480
NAME DESCRIPTION
Minimum Supply Voltage: 2.3 V
Package Body Material: Plastic/Epoxy
Organization: 300000 Gates
Maximum Time At Peak Reflow Temperature (s): 20 s
Maximum Seated Height: 1.55 mm
No. of Inputs: 100
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 100
Position Of Terminal: Bottom
No. of Terminals: 144
No. of Equivalent Gates: 300000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B144
Maximum Clock Frequency: 180 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: LBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 2.7 V
Nominal Supply Voltage (V): 2.5
Packing Method: Tray
Technology Used: CMOS
No. of Logic Cells: 8192
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Qualification: No
Package Equivalence Code: BGA144,12X12,40
Finishing Of Terminal Used: Tin Lead
Length: 13 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 235 °C (455 °F)
Power Supplies (V): 2.5,2.5/3.3 V
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Pricing (USD)

Qty. Unit Price Ext. Price
480 $591.080 $283,718.400

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