Microchip Technology - APA300-FG256I

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APA300-FG256I by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number APA300-FG256I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet APA300-FG256I Datasheet
In Stock53
NAME DESCRIPTION
Minimum Supply Voltage: 2.3 V
Package Body Material: Plastic/Epoxy
Organization: 300000 Gates
Maximum Time At Peak Reflow Temperature (s): 20 s
Maximum Seated Height: 1.8 mm
No. of Inputs: 186
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 186
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 300000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 180 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 2.7 V
Nominal Supply Voltage (V): 2.5
Packing Method: Tray
Technology Used: CMOS
No. of Logic Cells: 8192
JESD-609 Code: e0
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Lead
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 2.5,2.5/3.3 V
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