Microchip Technology - APA600-BG456

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APA600-BG456 by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number APA600-BG456
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
Datasheet APA600-BG456 Datasheet
In Stock792
NAME DESCRIPTION
Minimum Supply Voltage: 2.3 V
Package Body Material: Plastic/Epoxy
Organization: 600000 Gates
Maximum Seated Height: 2.54 mm
No. of Inputs: 356
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 356
Position Of Terminal: Bottom
No. of Terminals: 456
No. of Equivalent Gates: 600000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B456
Maximum Clock Frequency: 180 MHz
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: FPGA
Maximum Supply Voltage: 2.7 V
Nominal Supply Voltage (V): 2.5
Packing Method: Tray
Technology Used: CMOS
No. of Logic Cells: 21504
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA456,26X26,50
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1.27 mm
Power Supplies (V): 2.5,2.5/3.3 V
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