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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | AT91SAM7X512B-CU |
Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: TFBGA; Package Shape: SQUARE; |
Datasheet | AT91SAM7X512B-CU Datasheet |
In Stock | 669 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.65 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.8 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.1 mm |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) |
ADC Channels: | YES |
No. of Terminals: | 100 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
No. of I/O Lines: | 62 |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B100 |
Maximum Clock Frequency: | 50 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TFBGA |
Width: | 9 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 50 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 1.95 V |
External Data Bus Width: | 16 |
Bit Size: | 32 |
DAC Channels: | NO |
JESD-609 Code: | e2 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA100,10X10,32 |
Length: | 9 mm |
PWM Channels: | YES |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
CPU Family: | ARM7 |