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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | AT91SAM9260B-CU-100 |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | AT91SAM9260B-CU-100 Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.65 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.8 V |
Integrated Cache: | YES |
Maximum Seated Height: | 1.4 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
On Chip Data RAM Width: | 8 |
No. of Terminals: | 217 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
No. of DMA Channels: | 22 |
Address Bus Width: | 26 |
Technology: | CMOS |
RAM Words: | 8192 |
JESD-30 Code: | S-PBGA-B217 |
Maximum Clock Frequency: | 50 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LFBGA |
Width: | 15 mm |
Speed: | 210 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.95 V |
No. of External Interrupts: | 3 |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Bit Size: | 32 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA217,17X17,32 |
Length: | 15 mm |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |