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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | AT91SAM9G25-CU-999 |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | AT91SAM9G25-CU-999 Datasheet |
In Stock | 248 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | .9 V |
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Surface Mount: | YES |
No. of DMA Channels: | 16 |
Address Bus Width: | 26 |
Technology: | CMOS |
Maximum Clock Frequency: | 16 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | LFBGA |
No. of External Interrupts: | 2 |
Bit Size: | 32 |
DAC Channels: | NO |
Package Equivalence Code: | BGA217,17X17,32 |
PWM Channels: | YES |
Additional Features: | MMC(2), RS-485 |
Connectivity: | ETHERNET, HSMCI(2), I2C, I2S, IRDA, ISI, LIN, SPI(2), SSC, TWI(3), UART(2), USART(4), USB(3) |
ROM Programmability: | FLASH |
Analog To Digital Convertors: | 12-Ch 10-Bit |
Terminal Pitch: | .8 mm |
Nominal Supply Voltage: | 1 V |
Maximum Seated Height: | 1.4 mm |
Terminal Finish: | TIN SILVER COPPER |
ADC Channels: | YES |
No. of Terminals: | 217 |
No. of Timers: | 3 |
No. of Serial I/Os: | 7 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
No. of I/O Lines: | 105 |
JESD-30 Code: | S-PBGA-B217 |
ROM Words: | 65536 |
Maximum Operating Temperature: | 85 Cel |
Width: | 15 mm |
Data EEPROM Size: | 0 |
Speed: | 400 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.1 V |
RAM Bytes: | 32768 |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Peripherals: | DMA(16), POR, PWM(4), RTC, TIMER(3), WDT |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Length: | 15 mm |
On Chip Program ROM Width: | 8 |
Temperature Grade: | INDUSTRIAL |