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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | ATSAM4S4CB-CN |
| Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: TFBGA; Package Shape: SQUARE; |
| Datasheet | ATSAM4S4CB-CN Datasheet |
| In Stock | 10 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.08 V |
| Package Body Material: | PLASTIC/EPOXY |
| Integrated Cache: | NO |
| Surface Mount: | YES |
| On Chip Data RAM Width: | 8 |
| No. of DMA Channels: | 22 |
| Address Bus Width: | 24 |
| Technology: | CMOS |
| Maximum Clock Frequency: | 20 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | TFBGA |
| No. of External Interrupts: | 79 |
| Bit Size: | 32 |
| DAC Channels: | YES |
| Package Equivalence Code: | BGA100,10X10,32 |
| Digital To Analog Convertors: | 2-Ch 12-Bit |
| PWM Channels: | YES |
| Connectivity: | SPI, TWI(2), UART(2), USART(2), USB |
| ROM Programmability: | FLASH |
| Analog To Digital Convertors: | 16-Ch 12-Bit |
| Terminal Pitch: | .8 mm |
| CPU Family: | CORTEX-M4 |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Seated Height: | 1.1 mm |
| Maximum Supply Current: | 25 mA |
| Terminal Finish: | TIN SILVER COPPER |
| ADC Channels: | YES |
| No. of Terminals: | 100 |
| No. of Timers: | 6 |
| No. of Serial I/Os: | 4 |
| DMA Channels: | YES |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| No. of I/O Lines: | 79 |
| JESD-30 Code: | S-PBGA-B100 |
| ROM Words: | 262144 |
| Maximum Operating Temperature: | 105 Cel |
| Width: | 9 mm |
| Data EEPROM Size: | 0 |
| Speed: | 120 rpm |
| Peripheral IC Type: | MICROCONTROLLER, RISC |
| Maximum Supply Voltage: | 1.32 V |
| RAM Bytes: | 65536 |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 8 |
| Peripherals: | BOD, COMPARATOR, CRC, DMA(22), POR, PWM(4), RTC, TIMER(6), WDT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Length: | 9 mm |
| On Chip Program ROM Width: | 8 |
| Temperature Grade: | INDUSTRIAL |
