Microchip Technology - AX2000-FG896I

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AX2000-FG896I by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number AX2000-FG896I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;
Datasheet AX2000-FG896I Datasheet
In Stock54
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 21504 CLBS, 2000000 Gates
Maximum Combinatorial Delay of a CLB: 0.99 ns
Maximum Seated Height: 2.44 mm
No. of Inputs: 684
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 684
Position Of Terminal: Bottom
No. of Terminals: 896
No. of Equivalent Gates: 2000000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B896
Maximum Clock Frequency: 649 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Packing Method: Tray
Technology Used: CMOS
No. of Logic Cells: 32256
No. of CLBs: 21504
JESD-609 Code: e0
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA896,30X30,40
Finishing Of Terminal Used: Tin Lead
Length: 31 mm
Form Of Terminal: Ball
Additional Features: 2000000 system gates avaiable
Pitch Of Terminal: 1 mm
Power Supplies (V): 1.5,1.5/3.3,2.5/3.3 V
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