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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | BZV55C4V7/TR |
| Description | ZENER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND; |
| Datasheet | BZV55C4V7/TR Datasheet |
| In Stock | 879 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | GLASS |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Working Test Current: | 5 mA |
| Config: | SINGLE |
| Diode Type: | ZENER DIODE |
| Surface Mount: | YES |
| Maximum Reverse Current: | 3 uA |
| No. of Terminals: | 2 |
| Terminal Position: | END |
| Package Style (Meter): | LONG FORM |
| Technology: | ZENER |
| JESD-30 Code: | O-LELF-R2 |
| No. of Elements: | 1 |
| Package Shape: | ROUND |
| Terminal Form: | WRAP AROUND |
| Polarity: | UNIDIRECTIONAL |
| Maximum Operating Temperature: | 175 Cel |
| Case Connection: | ISOLATED |
| Maximum Dynamic Impedance: | 80 ohm |
| Reverse Test Voltage: | 2 V |
| JEDEC-95 Code: | DO-213AA |
| Minimum Operating Temperature: | -65 Cel |
| Maximum Voltage Tolerance: | 6.38 % |
| Diode Element Material: | SILICON |
| Nominal Reference Voltage: | 4.7 V |
| Additional Features: | METALLURGICALLY BONDED |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
