KSZ8873MLLAM by Microchip Technology | Telecommunications

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Manufacturer	Microchip Technology
Manufacturer's Part Number	KSZ8873MLLAM
Description	LAN SWITCHING CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet	KSZ8873MLLAM Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.8 V
Maximum Time At Peak Reflow Temperature (s):	30
Telecom IC Type:	LAN SWITCHING CIRCUIT
Maximum Seated Height:	1.6 mm
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	64
Qualification:	Not Qualified
Package Equivalence Code:	QFP64,.47SQ,20
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK, LOW PROFILE, FINE PITCH
Screening Level:	AEC-Q100; TS 16949
Length:	10 mm
JESD-30 Code:	S-PQFP-G64
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	260
Package Code:	LFQFP
Width:	10 mm
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL

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