Microchip Technology - M2GL025-FCS325

M2GL025-FCS325 by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number M2GL025-FCS325
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: BGA; Package Shape: SQUARE;
Datasheet M2GL025-FCS325 Datasheet
In Stock299
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 20 s
No. of Inputs: 180
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 180
Position Of Terminal: Bottom
No. of Terminals: 325
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B325
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 11 mm
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Packing Method: Tray
Technology Used: CMOS
No. of Logic Cells: 27696
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA325,21X21,20
Length: 11 mm
Form Of Terminal: Ball
Pitch Of Terminal: .5 mm
Peak Reflow Temperature (C): 240 °C (464 °F)
Power Supplies (V): 1.2 V
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Pricing (USD)

Qty. Unit Price Ext. Price
299 - -

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