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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | M2GL025T-1VF400 |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | M2GL025T-1VF400 Datasheet |
| In Stock | 534 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | Plastic/Epoxy |
| Maximum Time At Peak Reflow Temperature (s): | 20 s |
| Maximum Seated Height: | 1.51 mm |
| No. of Inputs: | 207 |
| Sub-Category: | Field Programmable Gate Arrays |
| Surface Mount: | Yes |
| No. of Outputs: | 207 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 400 |
| Package Style (Meter): | Grid Array, Low Profile, Fine Pitch |
| JESD-30 Code: | S-PBGA-B400 |
| Package Shape: | Square |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | LFBGA |
| Width: | 17 mm |
| Grading Of Temperature: | Other |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 1.26 V |
| Nominal Supply Voltage (V): | 1.2 |
| Packing Method: | Tray |
| No. of Logic Cells: | 27696 |
| Minimum Operating Temperature: | 0 °C (32 °F) |
| Qualification: | No |
| Package Equivalence Code: | BGA400,20X20,32 |
| Length: | 17 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | .8 mm |
| Peak Reflow Temperature (C): | 240 °C (464 °F) |
| Power Supplies (V): | 1.2 V |









