Microchip Technology - M2GL090T-1FGG676

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M2GL090T-1FGG676 by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number M2GL090T-1FGG676
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
Datasheet M2GL090T-1FGG676 Datasheet
In Stock1,579
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 2.44 mm
No. of Inputs: 425
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 425
Position Of Terminal: Bottom
No. of Terminals: 676
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Packing Method: Tray
Technology Used: CMOS
No. of Logic Cells: 86316
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA676,26X26,40
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
Power Supplies (V): 1.2 V
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