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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | M2S005-VFG400 |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM; |
| Datasheet | M2S005-VFG400 Datasheet |
| In Stock | 14 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | Plastic/Epoxy |
| Maximum Time At Peak Reflow Temperature (s): | 40 s |
| Maximum Seated Height: | 1.51 mm |
| No. of Inputs: | 171 |
| Surface Mount: | Yes |
| No. of Outputs: | 171 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 400 |
| Package Style (Meter): | Grid Array, Low Profile, Fine Pitch |
| JESD-30 Code: | S-PBGA-B400 |
| Package Shape: | Square |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | LFBGA |
| Width: | 17 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 1.26 V |
| Nominal Supply Voltage (V): | 1.2 |
| No. of Logic Cells: | 6060 |
| Minimum Operating Temperature: | 0 °C (32 °F) |
| Package Equivalence Code: | BGA400,20X20,32 |
| Finishing Of Terminal Used: | Tin Silver Copper |
| Length: | 17 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | .8 mm |
| Peak Reflow Temperature (C): | 250 °C (482 °F) |









